FEO MAGAZINE |
Issue 6 out now!
Welcome to the 6th issue of Fab Engineering & Operations magazine. You will note that this is a much “lighter” version of the magazine than previously published, but I don’t think the reasons behind this are any surprise. We all know what has been going on in the economy, and this issue of FEO is a harsh reminder. For now we have scaled back on the quantity of articles, but definitely not on the quality – what we present to you here will no doubt be of interest and offer value to some of your everyday work issues. Enjoy…
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In this issue:
Business Infrastructure
 INTRODUCTION, FEO6
The articles in Volume 6 of Fab Engineering
& Operations provide a few examples of activities
geared toward improving core operations.
Expense and scrap reduction, process optimization
and fostering healthy employee
morale are topics presented as important
reminders to look forward and prepare for better
days to come.
Keeping Your Sanity in Difficult Times: Staying Competitive While Making Hard Choices
A paper that provides strategies in tough economic times for strengthening your company and your workforce, as well as discusses advice from industry leaders for getting through this season
Asset Utilization
Photoresist Bar Code Monitor
An article describing the automated system implemented by NEC Electronics America semiconductor fab to monitor photoresist bottle changes on coaters.
Fab Productivity
DoE Method for Stress Optimization of PECVD Dielectric Thin Films Used in Microelectronics: Part II
An article describing the definition and application of design of experiment for PECVD thin dielectric films used at the final passivation level, in order to optimize the intrinsic stress.
Variability is the Root of Many Evils in Manufacturing
A focus on reducing/eliminating the largest category of loss, to aid fab management in reducing costs in 2009 and beyond.
Quality Control
High Performance and Zero GWP Fluorine-Based Chamber Cleaning Recipe
A paper focusing on the testing of a new F2 gas mixture, which was evaluated as a candidate to replace conventional cleaning gases, and its performance regarding etching rate and gas consumption.
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