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 FEO4 Section 3: Fab Productivity FEO Volume 4, August 28, 2008
Now more than ever, management needs to take time to look at proven ways to make the operational improvements required to reduce costs and improve productivity.
C. Richard Deininger, Taylor-Deininger Partners, Inc.
FEO3 Section 3: Fab Productivity FEO Volume 3, May 28, 2008
We have demonstrated our
ability to improve performance and reduce cost
given almost any economic condition. This publication
gives us another opportunity to further
our understanding of manufacturing in our
industry, to read and understand what others
are doing in our industry, carefully considering
the salient points in their papers, and then
determining if they can be successfully applied
in part or in whole in our specific factory.
Gregory D. Winterton, Texas Instruments
FEO3 Section 3: Fab Productivity FEO Volume 3, May 28, 2008
Part I of a 2-part paper on Lean Manufacturing in the semiconductor industry, addressing the matter of a fundamental premise of Lean: balanced production lines. In an environment where devices are smaller and with more delicate architectures, advanced process control (APC) becomes a need. In Part 1 of another 2-part paper, we look at the reasons why.
Kevin Venor, Avago Technologies
FEO5 : Fab Productivity FEO Volume 5, November 20, 2008
Despite our best engineering efforts to keep everything the same, the world has a different idea.
Gregory D. Winterton, Texas Instruments
FEO4 Section 3: Fab Productivity FEO Volume 4, August 28, 2008
Some companies fall into the trap of
reacting to the latest trend and putting a new
“system du jour” in place without fully understanding
the underlying forces and cultural
changes driving the need for improvement.
Matthew Nadeau, NEC Electronics America, Inc.
Lean Manufacturing in the Semiconductor Industry: Proceed with Caution – Part I FEO Volume 3, May 28, 2008
Lean Manufacturing is a methodology
proposed for improvement of factory performance.
Recently Lean has received attention
in semiconductor manufacturing.
Employed properly, Lean might improve
semiconductor factory performance. It is
not, however, a panacea. To achieve successful
and sustainable improvement, one
must be aware of its scope and limitations.
If not, Lean may cause more problems than
it solves. In this two-part paper, the applicability
of Lean in semiconductor manufacturing
is investigated. Part I addresses the matter
of a fundamental premise of Lean: balanced
production lines.
Manufacturing Science Consultant
INTRODUCTION: Fab Productivity 1 FEO Volume 2, February 29, 2008
This year the semiconductor industry is
experiencing a slowdown with many of the
IDMs and foundries cutting back on capital
expenditures. Cost reduction is uppermost on
the minds of fab management today. This FEO
section contains two papers which address the
cost and productivity issue.
C. Richard Deininger, Taylor-Deininger Partners, Inc.
INTRODUCTION: Fab Productivity 2 FEO Volume 2, February 29, 2008
A challenge for all manufacturing companies
is to maximize the capability of their operations
and to stay cost competitive with newer facilities.
This is especially true in the semiconductor
manufacturing arena where we have historically
experienced rapid progressions in technology
and constant pressure to reduce costs.
Matthew Nadeau, NEC Electronics America, Inc.
Introduction: Installation & Maintenance FEO Volume 1, November 20, 2007
Competing
with 300 mm fabs has placed cost and
technical resource pressure on the 200 mm
fabs.
Kevin Gray, Cypress Semiconductor, Mario Tellez, On Semiconductor
Support Strategy 200 mm Equipment 2008 FEO Volume 1, November 20, 2007
The mature 200 mm semiconductor market is faced with unparalleled cost challenges in the wake of 300 mm wafer pricing and the growth of 200 mm wafer production in low-cost regions.
Jazz Semiconductor
FEO5: Fab Productivity FEO Volume 5, November 20, 2008
Now more than ever, focusing on improving productivity and driving down cost should be high on the manufacturing manager’s list of focus areas.
Kevin Venor, Avago Technologies
Lean Manufacturing in the Semiconductor Industry: Proceed With Caution – Part 2 FEO Volume 4, August 28, 2008
A paper that investigates the applicability of Lean in semiconductor manufacturing; specifically, the appropriateness of CANDO and the employment of the Waddington Analysis.
Manufacturing Science Consultant
R2R in DCVD – Part I FEO Volume 3, May 28, 2008
Our industry crossed the sub-100nm
border into nanotechnology quite some time
ago. Sometimes, even irreducible differences
in the components of identical tool chambers
can influence yield results. In this demanding
environment of smaller and more delicate
architectures, as well as shorter and increasingly
unforgiving process windows, advanced
process control (APC) becomes a need.
Numonyx
Practical Considerations of Implementing R2R Controllers - Part 2: R2R Control Checklist FEO Volume 2, February 29, 2008
Most semiconductor manufacturers
consider run-to-run (R2R) control a vital
component of high-yielding production.
However, many still consider the development
and implementation of these controllers
as a “black box” process. This paper
is in two parts, wherein Part 1 primarily presented
an overview of common R2R terminology
along with the basics of feedback
and feedforward controllers, and Part 2
provides a detailed analysis on a checklist
to aid the reader in developing and implementing
R2R controllers and thereby
demystify them.
Karen Finn, K Finn Consulting, Inc., Katherine Thorn, University of South Alabama, Manish Misra, University of South Alabama
Using Electrostatic Discharge (ESD) Event Detection as a Predictive Maintenance Tool (Part 1 of 2) FEO Volume 1, November 20, 2007
Electrostatic discharge (ESD) events have been demonstrated to cause lockup issues in semiconductor manufacturing equipment, reducing mean time between failure (MTBF) and decreasing tool productivity.
Andrew C. Rudack, International SEMATECH North
DoE Method for Stress Optimization of PECVD Dielectric Thin Films Used in Microelectronics: Part I FEO Volume 5, November 20, 2008
Part 1 of a 2-part work dealing with definition and application of DoE for PECVD thin dielectric films in order to optimize the intrinsic stress. This part focuses on the final interconnection level.
Numonyx
R2R in DCVD – Part 2 FEO Volume 4, August 28, 2008
A look at system integration with automation and how an R2R system can be placed into a production scenario, showing how much a well-tuned R2R system can help control even the finest process.
Numonyx
Hidden Gold in Your Manufacturing Facility: It’s All Around You! FEO Volume 2, February 29, 2008
Psst, hey, want to see ~0.5 to 4 percent
yield improvement in under a year? You’re
missing an easy one! We have spent the past few months
investigating this issue, and detail what we
have learned below. We hope it helps you,
and believe the industry will benefit by
applying what we have learned.
Becky Taylor, Taylor-Deininger Partners, Inc., Dick Deininger, Taylor-Deininger Partners, Inc.
Advances in Wafer Reclaim Technology FEO Volume 5, November 20, 2008
A demonstration of how a specific test wafer reclaim process can reclaim test wafers yielding high substrate quality and low silicon loss, allowing for significantly more reclaim cycles than typical reclaim methods, which results in significant cost savings.
IBM Corporation
Introduction: Fab Connectivity FEO Volume 1, November 20, 2007
Fab productivity may seem like a dull subject,
but there is hidden gold buried inside the
operations by doing things the way they have
always been done.
C. Richard Deininger, Taylor-Deininger Partners, Inc.
Practical Considerations of Implementing R2R Controllers – Part 1: Basics of Feedback and Feedforward Controllers FEO Volume 1, November 20, 2007
This
article is in two parts, wherein Part 1
primarily presents an overview of common
R2R terminology along with the basics of
feedback and feedforward controllers.
Karen Finn, K Finn Consulting, Inc., Katherine Thorn, University of South Alabama, Manish Misra, University of South Alabama
Recipe Management Challenges for a Mainstream Fab FEO Volume 1, November 20, 2007
In order to improve cycle time and increase yield in a mainstream fab, automated recipe management is essential.
Don Phillips, Avago Technologies
Introduction: Capacity, Utilization & Cycle Time FEO Volume 1, November 20, 2007
The articles in this section touch on how to
better measure the impact of cycle time
improvements, as well as ways to improve the
utilization of existing tool sets.
Kevin Venor, Avago Technologies, Madan Chakravarthi, IE Systems at Chartered Semiconductor
Assets Optimization FEO Volume 1, November 20, 2007
As with any company, the main objective of the business is to improve the stakeholder value.
Lim Kian Wee, Chartered Semiconductor Manufacturing Ltd., Mohd Azizi Chik, Chartered Semiconductor Manufacturing Ltd., Lim Lip Hong, Chartered Semiconductor Manufacturing Ltd.
The Economics of Speed FEO Volume 1, November 20, 2007
Since the industrial revolution, a basic principle guiding all
manufacturing corporations is to evaluate two sides of their
organizations quite differently. One side is judged primarily on the
basis of the revenues they bring in. The other side is judged primarily
on the basis of expenditures.
Robert C. Leachman, Leachman & Associates LLC
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