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 FEO4 Section 2: Asset Utilization FEO Volume 4, August 28, 2008
Necessity is the mother of invention, as the saying goes...
TSMC Fab 12 Facilities
FEO3 Section 2: Asset Utilization FEO Volume 3, May 28, 2008
Semiconductor end markets have gradually moved from defense, to business, to consumer. A look at what fabs have to do to respond to the market demands. Plus, an approach to improving ICs being manufactured on their original 150 mm and 200 mm wafer platforms.
TSMC Fab 12 Facilities
FEO5: Asset Utilization FEO Volume 5, November 20, 2008
In this industry, where tough times come and go with the same frequency as the changing of seasons, the one thing that survival depends on is planning.
Kevin Gray, Cypress Semiconductor
Mixture DOE for Optimal Plasma Etch FEO Volume 4, August 28, 2008
How to uncover “sweet spots” where multiple fab-process specs can be met most efficaciously – includes a case study.
Scott Anderson, Balazs Analytical Services, a Division of Air Liquide Electronics U.S. LP
Rapid Returns on Cycle Time Investments FEO Volume 3, May 28, 2008
The need for reduced cycle time has
never been greater. Semiconductor end
markets have gradually moved from defense,
to business, to consumer. One of the largest
markets now for consumer products is
teenagers, whose desire for a new gadget
can change monthly … if not by lunch.
agileTCP
INTRODUCTION: Asset Utilization FEO Volume 2, February 29, 2008
The Asset Utilization section has two
articles that I can relate to: “Used Equipment:
Organization 101+” and “Installing 8-inch
Equipment in a 6-Inch-Generation Fab:
Equipment Move-in.” An example for both
occurred at Cypress Semiconductor.
Kevin Gray, Cypress Semiconductor
Introduction: Asset & Resource Utilization FEO Volume 1, November 20, 2007
This section of FEO will focus on how to
most effectively utilize the assets and
resources available relative to semiconductor
operations.
Gary Alexander, AMC Intl. LLC
Spansion Submicron Development Center 200 mm to 300 mm Conversion Feasibility Study Summary FEO Volume 5, November 20, 2008
A high-level summary of a provider of Flash memory solutions’ pre-conversion feasibility studies.
Spansion, Inc.
Installing 8-inch Equipment in a 6-Inch-Generation Fab: Raising the Roof FEO Volume 4, August 28, 2008
A look at how a fab’s ceiling can be modified to accommodate the larger assembled height of some taller 8-inch equipment.
Mark Crabtree, NEC Electronics America, Inc.
Facing the Wafer Size Upgrade Dilemma: To Convert or Not to Convert? FEO Volume 3, May 28, 2008
As the semiconductor industry
matures, there remains a number of legacy
ICs being manufactured in volume on
their original 150 mm, and to a lesser
degree, 200 mm wafer platforms that are
continuing to be in demand, albeit with
ever-reduced margins. One potential
approach to improving these products’
margins is to transition the manufacturing
process of an existing product to the next
larger wafer platform. Historically, moving
up from 125 mm to 150 mm, 150 mm to
200 mm, and 200 mm to 300 mm has
yielded substantial reductions in the cost
of good die out.
CH2M HILL
Installing 8-inch Equipment in a 6-Inch-Generation Fab: Equipment Move-in FEO Volume 2, February 29, 2008
Installing 8-inch equipment in a semiconductor
fab with 6-inch equipment can be a
viable option to increase production capacity
or to produce higher-technology devices.
However, fabs in the 6-inch generation may
not be designed to accommodate the larger
and heavier 8-inch tools, making it difficult
to move the equipment into the fab. In such
cases, building an elevated platform to raise
the equipment to fab level and then using
an air-bearing move-in system can provide
a solution.
Mark Crabtree, NEC Electronics America, Inc.
Used Equipment – A Guide to Secondhand Goods FEO Volume 1, November 20, 2007
This is the first in a series of FEO articles that is intended to focus on what companies in the semiconductor industry need to know in order to become more successful in sourcing secondhand equipment, as well as disposing of their surplus assets.
Gary Alexander, AMC Intl. LLC
Automation Capabilities Management (ACM): Past, Present and Future FEO Volume 5, November 20, 2008
An overview of past and present successes of automation capabilities management that also describes new challenges and opportunities ahead.
AMD Fab 36 LLC & Co. KG
Used Equipment: Organization 101+ FEO Volume 2, February 29, 2008
No curriculum in Business Administration
101 would be complete without studying the
classic functions of management: planning,
organizing, coordinating, directing and controlling.
Unfortunately, the market for secondhand
equipment is not very traditional,
especially when it comes to organization.
Gary Alexander, AMC Intl. LLC
Facility Assessment for a Fab Wafer Diameter Upgrade FEO Volume 1, November 20, 2007
Changing demands eventually outpace the capability and capacity of even the best-conceived fabs.
Texas Instruments
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