Our Partners

Home
About FEO
Download New Issue
Contact Us
Volume Archives
Editorial Panel
Business Listings


Mixture DOE for Optimal Plasma Etch
(8/28/2008) FEO Issue 4
By Scott Anderson, Balazs Analytical Services, a Division of Air Liquide Electronics U.S. LP
Print Article Print this paper
Send As Email Send as email

This article demonstrates how to uncover “sweet spots” where multiple fab-process specifications can be met in a most desirable way. It offers a reallife, semiconductor manufacturing case study that illustrates how to apply powerful response surface methods (RSM) for mixture design and statistical analysis.

Please login below to access the full text of this paper. If you are not currently an online member or subscriber sign-up today, it's free. For online membership, click here.

Email:
  Remember my User ID 
 

Not a member? Signup today, it's free.

 
 
Search


Published By:
38 Miller Avenue, Suite 9, Mill Valley, CA 94941
415.831.6800 | 415.831.6803
www.mazikmedia.com
converse@mazikmedia.com
Disclaimer | Privacy Policy