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Advances in Wafer Reclaim Technology
(11/20/2008) FEO Issue 5
By Allan Upham, IBM Corporation
Thomas Haigh Jr., IBM Corporation
Michael B. Korzenski, Advanced Technology Materials, Inc.
Christopher Watts, Advanced Technology Materials, Inc.
Tom Wu, Advanced Technology Materials, Inc.
Mark Robson, Advanced Technology Materials, Inc.
Thomas J.C. Hsieh, Kinik Company
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Reducing costs and increasing efficiency are universal initiatives in fab operations. One method of lowering costs is to reduce spending on test wafers through the use of test wafer reclaim. The RegenSiTM reclaim process increases the efficiency of the reclaim process by increasing reclaim yields and reducing the amount of silicon that needs to be removed in each reclaim cycle. IBM has been testing the RegenSi reclaim process at Kinik Co., ATMI’s reclaim partner, achieving very good performance (low LPDs and minimal silicon loss) both on standard BEOL test wafers as well as IBM’s latest generation of advanced ultra low-k dielectric (ULK) wafers.
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