|
Worldwide, there are several hundred existing semiconductor fabrication (fab) facilities currently producing devices using 200 mm substrates. The transition to 300 mm wafer manufacturing with its attendant economies of scale is well under way. The cost of building and tooling a new 300 mm factory can be prohibitive. If feasible, converting a 200 mm fab to 300 mm tooling eliminates about 14 percent of the capital required and about two years from the project schedule. Whether the fab remains in operation during the conversion is a key consideration.
Please login below to access the full text of this paper. If you are not currently an online member or subscriber sign-up today, it's free. For online membership, click here.
Not a member? Signup today, it's free.
|
