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Fast Learning Cycle (FLC) Methodology for Yield Improvement
(11/20/2008) FEO Issue 5
By Rafael Blatt, National Semiconductor, Inc.
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Semiconductor companies are faced with tremendous time-to-market pressures due to product cycles getting shorter and shorter with each new generation of wafer technology, and selling prices declining rapidly after new products are introduced. With shorter yield ramp of new technology nodes, there is less time to bring leading-edge products to volume production. As a result, there is a need in the fabs to quickly identify the yield loss mechanisms and put in place the necessary fixes to improve the yields.



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